技术资料

PECVD & ALD

• Deposition of SiOC:H Films Suitable for MEMS Manufacturing

• Atomic Layer Deposition (ALD) System Development for Power Device Applications

等离子刻蚀

• Plasma Dicing Solutions of a Variety of Materials

• GaAs Wafer Plasma Scribing with ICP Etching

• Plasma Dicing and Scribing Technology for GaAs Based Devices

• Precise Thickness Control in Recess Etching of AlGaN/GaN-HFET Manufacturing

• Deep Etching of Compound Semiconductors

• High-speed Etching of SiO₂ and SiC

• Scallop Free, Positive Tapered Si Via Etch Using SF₆ / O₂ Non-Bosch DRIE

• The Bosch Process Data: Low-scallop Etching Process and Sidewall Smoothing Process

• High-Speed, Deep Silicon Etching for R&D

等离子清洗

• Plasma Cleaning of LED Lighting Package