PECVD & ALD
• Deposition of SiOC:H Films Suitable for MEMS Manufacturing
• Atomic Layer Deposition (ALD) System Development for Power Device Applications
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• Plasma Dicing Solutions of a Variety of Materials
• GaAs Wafer Plasma Scribing with ICP Etching
• Plasma Dicing and Scribing Technology for GaAs Based Devices
• Precise Thickness Control in Recess Etching of AlGaN/GaN-HFET Manufacturing
• Deep Etching of Compound Semiconductors
• High-speed Etching of SiO2 and SiC
• Scallop Free, Positive Tapered Si Via Etch Using SF6 / O2 Non-Bosch DRIE
• The Bosch Process Data: Low-scallop Etching Process and Sidewall Smoothing Process
• High-Speed, Deep Silicon Etching for R&D
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