ø300 mm RIE Plasma Etching System RIE-300NR
Up to �300 mm (�12")
概要
The RIE-300NR is an ideal reactive ion etching system for processing of ø300 mm wafer and multiple wafers (ø3" x 12, ø4" x 8, etc.) with excellent uniformity. This system is designed to minimize factory space requirements, enhance throughput, maximize uptime, and reduce the cost of ownership through reliable hardware and ease of service.
主要特点和优点
- Processing up to ø350 mm (ø3" x 12, ø4" x 8, ø12" x 1)
- User-friendly touch screen interface
- Fully automatic “one-button” operation with full manual override
- An optimized shower head to deliver process gas uniformity
- A close coupled gas delivery box which reduces the residence time
- A symmetrical evacuation design coupled to a TMP creates an efficient flow
- Automatic pressure control that allows for precise control of process pressure independent of gas flow
- Dry pump and system layout allow for ease of maintenance
应用
- Removal of interlayer films for failure analysis of ø300 mm
- Etching of Si, SiO2, SiN and Poly-Si
- Etching of resins and desmear
- Photoresist ashing, stripping, and descuming
- Surface modification (wettability and adhesion improvement)
